IP Library Assignment 022779/0266
Patent Assignment
Reel/Frame 022779/0266

Assignment of Assignor's Interest

Recorded: 2009-06-04 Pages: 4
Assignors
CHONG, FU CHIUNG
Executed: 2007-12-18
BOTTOMS, W.R.
Executed: 2007-12-14
CHIEH, ERH-KONG
Executed: 2007-12-14
LITZA, ANNA
Executed: 2007-12-14
MCKAY, DOUGLAS L.
Executed: 2007-12-14
MILTER, ROMAN L.
Executed: 2007-12-14
LI, SHA
Executed: 2007-12-14
Assignee
NANONEXUS, INC.
2520 JUNCTION AVENUE, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
Application: 12/517,528 →
Publication: US 2010/0026331
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 7, 2010
From: NANONEXUS, INC.
To: NANONEXUS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 024640/0291 →
Assignment of Assignor's Interest Jul 7, 2010
From: NANONEXUS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: VERIGY (SINGAPORE) PTE. LTD.
Reel/Frame 024640/0301 →
Assignment of Assignor's Interest Mar 20, 2012
From: VERIGY (SINGAPORE) PTE LTD
To: ADVANTEST (SINGAPORE) PTE LTD
Reel/Frame 027896/0018 →