Patent Assignment
Reel/Frame 022840/0036
Assignment of Assignor's Interest
Recorded: 2009-06-17
Pages: 214
Assignor
MICRON TECHNOLOGY, INC.
Executed: 2008-09-26
Assignee
APTINA IMAGING CORPORATION
C/O CITCO TRUSTEES (CAYMAN) LIMITED, REGATTA OFFICE PARK, WEST BAY ROAD, GRAND CAYMAN, Y1-1205, CAYMAN ISLANDS
Covered Properties
(2)
Microelectronic Imagers with Stacked Lens Assemblies and Processes for Wafer-Level Packaging of Microelectronic Imagers
Application:
12/147,421 →
Publication:
US 2009/0321861
Microelectronic Imager Packages with Covers Having Non-Planar Surface Features
Application:
12/173,658 →
Publication:
US 2010/0013041
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 26, 2008
From: OLIVER, STEVEN D.; LAKE, RICK C.; BOETTIGER, ULRICH C.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 021157/0937 →
Assignment of Assignor's Interest
Jul 15, 2008
From: BOLT, LARRY D.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 021240/0490 →
Assignment of Assignor's Interest
Oct 23, 2014
From: APTINA IMAGING CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034037/0711 →
Security Interest
Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
Corrective Assignment to Correct the Incorrect Patent Number 5859768 and to Recite Collateral Agent Role of Receiving Party in the Security Interest Previously Recorded on Reel 038620 Frame 0087. Assignor(S) Hereby Confirms the Security Interest.
Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
Release of Security Interest in Patents Recorded at Reel 038620, Frame 0087
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →