Patent Assignment
Reel/Frame 022898/0615
Assignment of Assignor's Interest
Recorded: 2009-06-30
Pages: 214
Assignor
MICRON TECHNOLOGY, INC.
Executed: 2008-10-03
Assignee
APTINA IMAGING CORPORATION
C/O CITCO TRUSTEES (CAYMAN) LIMITED, REGATTA OFFICE PARK, WEST BAY ROAD, GRAND CAYMAN, KY1-1205, CAYMAN ISLANDS
Covered Properties
(5)
Method and System for Fabricating Semiconductor Components with Lens Structures and Lens Support Structures
Microelectronic Imaging Units Having an Infrared-Absorbing Layer and Associated Systems and Methods
Application:
11/951,528 →
Publication:
US 2009/0146234
Emi Shielding for Imager Devices
Microelectronic Devices Having an Emi Shield and Associated Systems and Methods
Reduced-Dimension Microelectronic Component Assemblies with Wire Bonds and Methods of Making Same
Application:
12/136,687 →
Publication:
US 2008/0296781
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 28, 2006
From: PERKINS, ANDREW E.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 018624/0407 →
Assignment of Assignor's Interest
Dec 6, 2007
From: LUO, SHIJIAN; JIANG, TONGBI; BROOKS, J. MICHAEL
To: MICRON TECHNOLOGY, INC.
Reel/Frame 020205/0389 →
Assignment of Assignor's Interest
Dec 28, 2007
From: ENGLAND, LUKE
To: MICRON TECHNOLOGY, INC.
Reel/Frame 020302/0536 →
Assignment of Assignor's Interest
May 7, 2008
From: MORRISON, MICHAEL W.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 020915/0132 →
Assignment of Assignor's Interest
Oct 23, 2014
From: APTINA IMAGING CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034037/0711 →
Security Interest
Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
Corrective Assignment to Correct the Incorrect Patent Number 5859768 and to Recite Collateral Agent Role of Receiving Party in the Security Interest Previously Recorded on Reel 038620 Frame 0087. Assignor(S) Hereby Confirms the Security Interest.
Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
Release of Security Interest in Patents Recorded at Reel 038620, Frame 0087
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →