Patent Assignment
Reel/Frame 023014/0778
Assignment of Assignor's Interest
Recorded: 2009-07-28
Pages: 3
Assignee
NIPPON MINING & METALS CO., LTD.
10-1, TORANOMON 2-CHOME, MINATO-KU, TOKYO, 105-0001, JAPAN
Covered Property
(1)
Copper Anode or Phosphorous-Containing Copper Anode, Method of Electroplating Copper on Semiconductor Wafer, and Semiconductor Wafer with Low Particle Adhesion
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Oct 8, 2010
From: NIPPON MINING & METALS CO., LTD.
To: NIPPON MINING HOLDINGS, INC.
Reel/Frame 025115/0675 →
Change of Name
Oct 12, 2010
From: NIPPON MINING HOLDINGS, INC.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 025123/0420 →
Change of Address
Feb 7, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041649/0733 →
Change of Address
Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →