Patent Assignment
Reel/Frame 023158/0350
Assignment of Assignor's Interest
Recorded: 2009-08-27
Pages: 4
Assignors
PARK, NO SUN
Executed: 2009-08-26
CHUNG, YOUNG SUK
Executed: 2009-08-26
SHIM, JAE BEOM
Executed: 2009-08-26
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Wafer Level Chip Size Package Having Redistribution Layers
Patent:
7,977,783 →
Application:
12/549,083 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Dec 6, 2012
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 029422/0178 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →