IP Library › Assignment 023244/0485
Patent Assignment
Reel/Frame 023244/0485

Assignment of Assignor's Interest

Recorded: 2009-09-17 Pages: 3
Assignors
HETZEL, WOLFGANG
Executed: 2009-08-06
THOMAS, JOCHEN
Executed: 2009-08-24
Assignee
QIMONDA AG
GUSTAV-HEINEMANN-RING 212, MUNICH, 81739, GERMANY
Covered Property (1)
Semiconductor Device with Plastic Package Molding Compound, Semiconductor Chip and Leadframe and Method for Producing the Same
Patent: 8,072,085 →
Application: 10/577,173 →
Publication: US 2010/0032817
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 12, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023768/0001 →
Assignment of Assignor's Interest May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest Oct 16, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036877/0513 →