Patent Assignment
Reel/Frame 023252/0680
Assignment of Assignor's Interest
Recorded: 2009-09-18
Pages: 4
Assignors
PAEK, JONG SIK
Executed: 2009-09-17
PARK, IN BAE
Executed: 2009-09-17
LEE, CHANG DEOK
Executed: 2009-09-17
Assignee
AMKOR TECHONOLOGY KOREA, INC.
280-8, SUNGSU 2GA 3 DONG, SUNGDONG-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Stackable Wafer Level Package and Fabricating Method Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.