Patent Assignment
Reel/Frame 023349/0294
Assignment of Assignor's Interest
Recorded: 2009-10-08
Pages: 2
Assignor
YANG, DAE GUN
Executed: 2000-10-10
Assignee
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD
SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Metal Layer in Semiconductor Device Including a Planar Stuffed Layer and an Insulating Film with a Projection
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 10, 2005
From: HYNIX SEMICONDUCTOR, INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 016216/0649 →
Security Interest
Mar 25, 2005
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 016470/0530 →
Assignment of Assignor's Interest
May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
Partial Release of Security Interest
May 30, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 022746/0870 →
Assignment of Assignor's Interest
Aug 12, 2009
From: CROSSTEK CAPITAL, LLC
To: CHUNG CHENG HOLDINGS, LLC
Reel/Frame 023085/0877 →
Assignment of Assignor's Interest
Feb 12, 2023
From: CHUNG CHENG HOLDINGS, LLC
To: INTELLECTUAL VENTURES ASSETS 186 LLC
Reel/Frame 062667/0100 →
Security Interest
Mar 24, 2023
From: MIND FUSION, LLC
To: INTELLECTUAL VENTURES ASSETS 191 LLC; INTELLECTUAL VENTURES ASSETS 186 LLC
Reel/Frame 063295/0001 →
Assignment of Assignor's Interest
Jul 13, 2023
From: INTELLECTUAL VENTURES ASSETS 186 LLC
To: MIND FUSION, LLC
Reel/Frame 064271/0001 →