Patent Assignment
Reel/Frame 062667/0100
Assignment of Assignor's Interest
Recorded: 2023-02-12
Pages: 4
Assignor
CHUNG CHENG HOLDINGS, LLC
Executed: 2022-12-22
Assignee
INTELLECTUAL VENTURES ASSETS 186 LLC
251 LITTLE FALLS DRIVE, WILMINGTON, DELAWARE, 19808
Covered Properties
(3)
Metal layer in semiconductor device and method for fabricating the same
Patent:
6,352,877 →
Application:
09/696,200 →
Metal Layer in Semiconductor Device Including a Planar Stuffed Layer and an Insulating Film with a Projection
Method for Fabricating Semiconductor Device
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
After-Acquired Intellectual Property Kun-Pledge Agreement
Feb 18, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 022277/0133 →
Partial Release of Security Interest
May 30, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 022746/0870 →
Assignment of Assignor's Interest
May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
Partial Release of Security Interest
Aug 10, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 023075/0054 →
Assignment of Assignor's Interest
Aug 12, 2009
From: CROSSTEK CAPITAL, LLC
To: CHUNG CHENG HOLDINGS, LLC
Reel/Frame 023085/0877 →
Assignment of Assignor's Interest
Oct 8, 2009
From: YANG, DAE GUN
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD
Reel/Frame 023349/0294 →
Security Interest
Mar 24, 2023
From: MIND FUSION, LLC
To: INTELLECTUAL VENTURES ASSETS 191 LLC; INTELLECTUAL VENTURES ASSETS 186 LLC
Reel/Frame 063295/0001 →
Assignment of Assignor's Interest
Jul 13, 2023
From: INTELLECTUAL VENTURES ASSETS 186 LLC
To: MIND FUSION, LLC
Reel/Frame 064271/0001 →