IP Library › Assignment 023411/0667
Patent Assignment
Reel/Frame 023411/0667

Assignment of Assignor's Interest

Recorded: 2009-10-22 Pages: 2
Assignors
LIU, CHI KANG
Executed: 2004-08-30
YU, TALEE
Executed: 2004-08-30
Assignee
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANG JIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property (1)
Device Under Bonding Pad Using Single Metallization
Patent: 8,373,272 →
Application: 12/582,690 →
Publication: US 2011/0037177
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 14, 2013
From: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
Reel/Frame 029625/0763 →