Patent Assignment
Reel/Frame 023443/0636
Assignment of Assignor's Interest
Recorded: 2009-10-29
Pages: 6
Assignors
HUEMOELLER, RONALD PATRICK
Executed: 2009-10-20
ANDERSON, REX
Executed: 2009-10-22
CHILUKURI, RAVI KIRAN
Executed: 2009-10-22
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Bumped Chip Package Fabrication Method and Structure
Patent:
7,994,045 →
Application:
12/555,449 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Dec 6, 2012
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 029422/0178 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →