IP Library › Assignment 023459/0218
Patent Assignment
Reel/Frame 023459/0218

Assignment of Assignor's Interest

Recorded: 2009-10-29 Pages: 3
Assignor
II-VI INCORPORATED
Executed: 2009-10-28
Assignee
ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
1093 CLARK STREET, ENDICOTT, NEW YORK, 13760
Covered Property (1)
Method of testing spacings in pattern of openings in PCB conductive layer
Patent: 7,013,563 →
Application: 10/616,932 →
Publication: US 2005/0005438
Related Assignments (14)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 11, 2003
From: DURKOT, JOHN
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 014273/0460 →
Security Agreement May 10, 2005
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: WACHOVIA BANK, NATIONAL ASSOCIATION, AS AGENT
Reel/Frame 016561/0605 →
Assignment of Assignor's Interest May 18, 2007
From: WACHOVIA BANK, NATIONAL ASSOCIATION, AS AGENT
To: WACHOVIA CAPITAL FINANCE CORPORATION ( NEW ENGLAND), AS AGENT
Reel/Frame 019304/0676 →
Release of Security Interest Nov 20, 2008
From: WACHOVIA CAPITAL FINANCE CORPORATION
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 021861/0869 →
Security Agreement Dec 3, 2008
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 021912/0908 →
Security Agreement May 14, 2012
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 028230/0798 →
Release by Secured Party May 14, 2012
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 028230/0611 →
Assignment of Security Agreement Mar 6, 2013
From: PNC BANK, NATIONAL ASSOCIATION
To: INTEGRIAN HOLDINGS, LLC
Reel/Frame 029938/0823 →
Security Agreement May 6, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.; INTEGRIAN HOLDINGS, LLC
To: M&T BANK
Reel/Frame 030359/0057 →
Security Agreement Jun 12, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: MAINES, WILLIAM; MAINES, DAVID
Reel/Frame 030599/0918 →
Release of Security Interest Feb 26, 2015
From: MAINES, WILLIAM; MAINES, DAVID
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 035098/0968 →
Assignment of Assignor's Interest Apr 16, 2015
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: I3 ELECTRONICS, INC.
Reel/Frame 035442/0569 →
Security Interest Nov 14, 2016
From: I3 ELECTRONICS, INC.
To: M&T BANK
Reel/Frame 040608/0626 →
Assignment of Assignor's Interest Jul 15, 2019
From: I3 ELECTRONICS, INC.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 049758/0265 →