IP Library › Assignment 023695/0319
Patent Assignment
Reel/Frame 023695/0319

Assignment of Assignor's Interest

Recorded: 2009-12-23 Pages: 4
Assignors
HSIUNG, HSIN-CHANG
Executed: 2009-11-20
TAN, CHIH-WEI
Executed: 2009-11-24
SU, PO-LIN
Executed: 2009-11-24
Assignee
WISEPAL TECHNOLOGIES, INC.
NO.26, ZIH LIAN ROAD, FONGHUA VILLAGE, SINSHIH TOWNSHIP, TAINAN COUNTY, 74445, TAIWAN
Covered Property (1)
Fabricating Method and Structure of a Wafer Level Module
Patent: 8,193,599 →
Application: 12/646,094 →
Publication: US 2011/0049547
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 12, 2012
From: WISEPAL TECHNOLOGIES, INC.
To: HIMAX SEMICONDUCTOR, INC.
Reel/Frame 027531/0728 →
Assignment of Assignor's Interest Jun 28, 2018
From: HIMAX SEMICONDUCTOR, INC.
To: HIMAX TECHNOLOGIES LIMITED
Reel/Frame 046222/0554 →