IP Library › Assignment 027531/0728
Patent Assignment
Reel/Frame 027531/0728

Change of Name

Recorded: 2012-01-12 Pages: 6
Assignor
WISEPAL TECHNOLOGIES, INC.
Executed: 2010-02-11
Assignee
HIMAX SEMICONDUCTOR, INC.
NO.26, ZILIAN RD., XINSHI DIST., TAINAN CITY, 74148, TAIWAN
Covered Property (1)
Fabricating Method and Structure of a Wafer Level Module
Patent: 8,193,599 →
Application: 12/646,094 →
Publication: US 2011/0049547
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 23, 2009
From: HSIUNG, HSIN-CHANG; TAN, CHIH-WEI; SU, PO-LIN
To: WISEPAL TECHNOLOGIES, INC.
Reel/Frame 023695/0319 →
Assignment of Assignor's Interest Jun 28, 2018
From: HIMAX SEMICONDUCTOR, INC.
To: HIMAX TECHNOLOGIES LIMITED
Reel/Frame 046222/0554 →