Fabricating method and structure of a wafer level module
A fabricating method includes adhering an exposed surface of a first solid adhesive film to a first substrate. The second surface of the first solid adhesive film is exposed and adhered to a second substrate. A third substrate is adhered to a second substrate via a patterned second solid adhesive film, and a diaphragm layer is adhered to the third substrate via a patterned third solid adhesive film. A fourth solid adhesive film with a removable release film is adhered to the first substrate covered, followed by slicing to form wafer level lens modules.
1. A method of fabricating a wafer level module, comprising:
providing a first solid adhesive film with a first release film and a second release film that respectively cover a first surface and a second surface of the first solid adhesive film;
patterning a plurality of openings through the first solid adhesive film;
removing the first release film to expose the first surface of the first solid adhesive film; aligning and adhering the exposed first surface of the first solid adhesive film to a first substrate;
removing the second release film to expose the second surface of the first solid adhesive film;
aligning and adhering the exposed second surface of the first solid adhesive film to a second substrate;
aligning and adhering a third substrate to the second substrate via a patterned second solid adhesive film;
aligning and adhering a diaphragm layer to the third substrate via a patterned third solid adhesive film;
aligning and adhering a fourth solid adhesive film to the first substrate with one removable release film covering the fourth solid adhesive film; and
performing slicing to form a plurality of wafer level lens modules with the removable release film;
wherein the first substrate comprises a first spacer layer and the second substrate comprises a lens substrate.
2. The method of claim 1 , wherein the first solid adhesive film comprises thermosetting material.
3. The method of claim 2 , wherein the first solid adhesive film comprises epoxy.
4. The method of claim 1 , wherein the openings are patterned by punching or laser cutting.
5. The method of claim 1 , wherein the openings are patterned by etching.
6. The method of claim 1 , wherein the first substrate and the second substrate are subjected to heat, pressure, ultra violet or their combination.
7. The method of claim 1 , wherein the diaphragm layer comprises a solid adhesive film that is dyed.
8. The method of claim 1 , further comprising:
removing the one removable release film covering the fourth solid adhesive film; and
aligning and adhering the fourth solid adhesive film to an image sensor.