Patent Assignment
Reel/Frame 023698/0517
Carve-Out and Contribution Agreement
Recorded: 2009-12-23
Pages: 30
Assignor
INFINEON TECHNOLOGIES AG
Executed: 2006-04-25
Assignee
QIMONDA AG
GUSTAV-HEINEMANN-RING 212, MUNICH, 81739, GERMANY
Covered Properties
(2)
Method of Producing an Electronic Component with Flexible Bonding Pads
Electronic Component with Semiconductor Chips, Electronic Assembly Composed of Stacked Semiconductor Chips, and Methods for Producing an Electronic Component and an Electronic Assembly
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest
Aug 19, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036396/0646 →
Assignment of Assignor's Interest
Sep 15, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036615/0885 →