Patent Assignment
Reel/Frame 023796/0685
Assignment of Assignor's Interest
Recorded: 2010-01-14
Pages: 6
Assignor
INTERNATIONAL BUSINESS MACHINES CORPORATION
Executed: 2009-09-30
Assignee
TESSERA INTELLECTUAL PROPERTIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(16)
Chip Stacking by Edge Metallization
Patent:
5,818,107 →
Application:
08/785,187 →
Full Additive Process with Filled Plated Through Holes
Patent:
6,195,883 →
Application:
09/047,984 →
Surface Metal Balancing to Reduce Chip Carrier Flexing
Patent:
6,497,943 →
Application:
09/503,395 →
High Density Design for Organic Chip Carriers
Patent:
6,538,213 →
Application:
09/506,951 →
Method to Reduce Number of Wire-Bond Loop Heights Versus the Total Quantity of Power and Signal Rings
Patent:
6,414,386 →
Application:
09/531,971 →
Organic Dielectric Electronic Interconnect Structures and Method for Making
Patent:
6,931,723 →
Application:
09/665,366 →
Reduction of Chip Carrier Flexing During Thermal Cycling
Patent:
6,528,179 →
Application:
09/691,935 →
Full Additive Process with Filled Plated Through Holes
Full Additive Process with Filled Plated Through Holes
Chip Carrier for a High-Frequency Electronic Package
Method and Packaging Structure for Optimizing Warpage of Flip Chip Organic Packages
Electronic Package with Filled Blinds Vias
Method of Forming Filled Blind Vias
Method and Packaging Structure for Optimizing Warpage of Flip Chip Organic Packages
Method to Reduce Number of Wire-Bond Loop Heights Versus the Total Quantity of Power and Signal Rings
Organic Dielectric Electronic Interconnect Structures and Method for Making
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →