Patent Assignment
Reel/Frame 023970/0823
Assignment of Assignor's Interest
Recorded: 2010-02-22
Pages: 9
Assignors
CHIEN, JACK CHANG
Executed: 2010-02-22
ONG, KH
Executed: 2010-02-12
WANG, WEILI
Executed: 2010-02-12
WANG, LI
Executed: 2010-02-10
LIANG, XINGZHI
Executed: 2010-02-22
MA, SHICAI
Executed: 2010-02-19
Assignee
SANDISK CORPORATION
601 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
System for Separating a Diced Semiconductor Die from a Die Attach Tape
Application:
12/709,952 →
Publication:
US 2011/0084377
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 16, 2011
From: SANDISK CORPORATION
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 026286/0203 →
Change of Name
May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038809/0672 →
Assignment of Assignor's Interest
Nov 12, 2021
From: SANDISK TECHNOLOGIES LLC
To: WODEN TECHNOLOGIES INC.
Reel/Frame 058871/0928 →