Patent Assignment
Reel/Frame 026286/0203
Assignment of Assignor's Interest
Recorded: 2011-05-16
Pages: 6
Assignor
SANDISK CORPORATION
Executed: 2011-04-04
Assignee
SANDISK TECHNOLOGIES INC.
6900 NORTH DALLAS PARKWAY, TWO LEGACY TOWN CENTER, PLANO, TEXAS, 75024
Covered Property
(1)
System for Separating a Diced Semiconductor Die from a Die Attach Tape
Application:
12/709,952 →
Publication:
US 2011/0084377
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 22, 2010
From: CHIEN, JACK CHANG; ONG, KH; WANG, WEILI; WANG, LI
To: SANDISK CORPORATION
Reel/Frame 023970/0823 →
Change of Name
May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038809/0672 →
Assignment of Assignor's Interest
Nov 12, 2021
From: SANDISK TECHNOLOGIES LLC
To: WODEN TECHNOLOGIES INC.
Reel/Frame 058871/0928 →