IP Library › Assignment 024126/0584
Patent Assignment
Reel/Frame 024126/0584

Assignment of Assignor's Interest

Recorded: 2010-03-24 Pages: 3
Assignors
JAUNAY, SERGE
Executed: 2010-03-05
BELANI, SURESH
Executed: 2010-03-05
KUO, FRANK
Executed: 2010-03-05
MAO, SEN
Executed: 2010-03-05
WANG, PETER
Executed: 2010-03-05
Assignee
VISHAY-SILICONIX
2201 LAURELWOOD ROAD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Semiconductor Packages Including Die and L-Shaped Lead and Method of Manufacture
Patent: 8,586,419 →
Application: 12/730,230 →
Publication: US 2011/0175217
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 13, 2010
From: VISHAY-SILICONIX
To: JAUNAY, SERGE; BELANI, SURESH; KUO, FRANK; MAO, SEN
Reel/Frame 024526/0642 →
Security Agreement Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
Security Interest Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
Release of Security Interest Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED
Reel/Frame 049826/0312 →