Patent Assignment
Reel/Frame 024526/0642
Assignment of Assignor's Interest
Recorded: 2010-06-13
Pages: 3
Assignor
VISHAY-SILICONIX
Executed: 2010-06-10
Assignees
JAUNAY, SERGE
1234 MCINTOSH COURT, SUNNYVALE, CALIFORNIA, 94087
BELANI, SURESH
11645 PUTTER WAY, LAS ALTOS, CALIFORNIA, 94024
KUO, FRANK
8F, NO. 30, LIN-CUAN ST, LING-YA DIST., KAOHSIUNG, TAIWAN
MAO, SEN
NO. 117-16, CONG-SHI-XIN-CUN, ZUO-YIN, KAOHSIUNG, TAIWAN
WANG, PETER
NO. 24, LANE 323, WANZHONG ST., SANMIN DIST., KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Packages Including Die and L-Shaped Lead and Method of Manufacture
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 24, 2010
From: JAUNAY, SERGE; BELANI, SURESH; KUO, FRANK; MAO, SEN
To: VISHAY-SILICONIX
Reel/Frame 024126/0584 →
Security Agreement
Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
Security Interest
Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
Release of Security Interest
Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED
Reel/Frame 049826/0312 →