Patent Assignment
Reel/Frame 024260/0033
Assignment of Assignor's Interest
Recorded: 2010-04-20
Pages: 8
Assignors
PURUSHOTHAMAN, SAMPATH
Executed: 2010-03-18
ROTHWELL, MARY E.
Executed: 2010-03-23
SHAHIDI, GHAVAM GHAVAMI
Executed: 2010-03-18
YU, ROY RONGQUING
Executed: 2010-03-25
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Lock and Key Through-via Method for Wafer Level 3D Integration and Structures Produced
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Assignment of Assignor's Interest
Jun 27, 2019
From: GLOBALFOUNDRIES INC.
To: ALSEPHINA INNOVATIONS INC.
Reel/Frame 049612/0211 →
Release of Security Interest
Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →