Patent Assignment
Reel/Frame 024398/0015
Assignment of Assignor's Interest
Recorded: 2010-05-17
Pages: 7
Assignors
HU, JUNWEI
Executed: 2010-05-13
YEE, JAEHAK
Executed: 2010-05-13
TAN, LIN
Executed: 2010-05-13
QU, WENBIN
Executed: 2010-05-13
FENG, YUFENG
Executed: 2010-05-13
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Method of Forming Perforated Opening in Bottom Substrate of Flipchip Pop Assembly to Reduce Bleeding of Underfill Material
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0427 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053476/0094 →