Patent Assignment
Reel/Frame 024513/0004
Assignment of Assignor's Interest
Recorded: 2010-05-28
Pages: 4
Assignor
OKAJI, SHIGEHARU
Executed: 2010-03-31
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Manufacturing Method of Semiconductor Device Including Au Bump on Seed Film
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.