Patent Assignment
Reel/Frame 029218/0746
Change of Name
Recorded: 2012-10-15
Pages: 5
Assignor
OKAJI, SHIGEHARU
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Manufacturing Method of Semiconductor Device Including Au Bump on Seed Film
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.