Patent Assignment
Reel/Frame 024519/0655
Assignment of Assignor's Interest
Recorded: 2010-06-10
Pages: 10
Assignors
HABA, BELGACEM
Executed: 2008-04-24
HONER, KENNETH ALLEN
Executed: 2008-05-12
TUCKERMAN, DAVID B.
Executed: 2008-09-09
OGANESIAN, VAGE
Executed: 2008-05-13
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Chips Having Rear Contacts Connected by Through Vias to Front Contacts
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 31, 2011
From: TESSERA, INC.
To: TESSERA TECHNOLOGIES IRELAND LIMITED
Reel/Frame 026110/0370 →
Change of Name
May 4, 2012
From: TESSERA TECHNOLOGIES IRELAND LIMITED
To: DIGITALOPTICS CORPORATION EUROPE LIMITED
Reel/Frame 028170/0196 →
Assignment of Assignor's Interest
Mar 20, 2013
From: DIGITALOPTICS CORPORATION EUROPE LIMITED
To: INVENSAS CORPORATION
Reel/Frame 030065/0817 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →