IP Library › Assignment 026110/0370
Patent Assignment
Reel/Frame 026110/0370

Assignment of Assignor's Interest

Recorded: 2011-03-31 Pages: 5
Assignor
TESSERA, INC.
Executed: 2011-03-25
Assignee
TESSERA TECHNOLOGIES IRELAND LIMITED
CLIONA BUILDING ONE, PARKMORE EAST BUSINESS PARK, BALLYBRIT, GALWAY, IRELAND
Covered Properties (4)
Microelectronic Assembly with Multi-Layer Support Structure
Patent: 8,604,605 →
Application: 11/650,356 →
Publication: US 2008/0165519
Chips Having Rear Contacts Connected by Through Vias to Front Contacts
Patent: 8,405,196 →
Application: 12/072,508 →
Publication: US 2008/0246136
Semiconductor Packaging Process Using Through Silicon Vias
Patent: 8,193,615 →
Application: 12/221,204 →
Publication: US 2009/0065907
Chips Having Rear Contacts Connected by Through Vias to Front Contacts
Patent: 8,310,036 →
Application: 12/784,841 →
Publication: US 2010/0225006
Related Assignments (12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 27, 2007
From: NYSTROM, MICHAEL J.; HUMPSTON, GILES
To: TESSERA, INC.
Reel/Frame 019635/0756 →
Assignment of Assignor's Interest Sep 10, 2008
From: HABA, BELGACEM; HONER, KENNETH ALLEN; TUCKERMAN, DAVID B.; OGANESIAN, VAGE
To: TESSERA, INC.
Reel/Frame 021513/0144 →
Assignment of Assignor's Interest Nov 13, 2008
From: HABA, BELGACEM; HUMPSTON, GILES; MARGALIT, MOTI
To: TESSERA, INC.
Reel/Frame 021834/0364 →
Assignment of Assignor's Interest Nov 13, 2008
From: HABA, BELGACEM; HUMPSTON, GILES; MARGALIT, MOTI
To: TESSERA, INC.
Reel/Frame 021833/0685 →
Assignment of Assignor's Interest Jun 10, 2010
From: HABA, BELGACEM; HONER, KENNETH ALLEN; TUCKERMAN, DAVID B.; OGANESIAN, VAGE
To: TESSERA, INC.
Reel/Frame 024519/0655 →
Change of Name May 4, 2012
From: TESSERA TECHNOLOGIES IRELAND LIMITED
To: DIGITALOPTICS CORPORATION EUROPE LIMITED
Reel/Frame 028170/0196 →
Assignment of Assignor's Interest Mar 20, 2013
From: DIGITALOPTICS CORPORATION EUROPE LIMITED
To: INVENSAS CORPORATION
Reel/Frame 030065/0817 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0807 →
Change of Name Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0758 →