Patent Assignment
Reel/Frame 024540/0817
Assignment of Assignor's Interest
Recorded: 2010-06-15
Pages: 5
Assignors
JIN, WEI QIANG
Executed: 2010-05-17
YEE, JAE HAK
Executed: 2010-05-17
WANG, YA PING
Executed: 2010-05-17
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Properties
(2)
Integrated Circuit Package Stacking System with Lead Overlap and Method of Manufacture Thereof
Application:
12/782,164 →
Publication:
US 2011/0248391
Integrated Circuit Package Stacking System with Lead Overlap and Method of Manufacture Thereof
Application:
61/322,290 →
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053476/0094 →