INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH LEAD OVERLAP AND METHOD OF MANUFACTURE THEREOF

1 . A method of manufacture of an integrated circuit package stacking system comprising:

providing a bottom package including:

providing a first lead frame,

forming a bottom package body having the first lead frame in an off-centered parting line position, and

forming bottom connection leads of the first lead frame for providing coplanar contacts at an end of the bottom connection leads;

mounting a top package on the bottom package including:

providing a second lead frame,

forming a top package body on the second lead frame, and

reforming top connection leads of the second lead frame for over-lapping contact areas on the bottom connection leads of the bottom package; and

applying a conductive adhesive on the contact areas for electrically connecting the top connection leads and the bottom connection leads.

2 . The method of claim 1 wherein mounting the top package includes mounting a center parting line package.

3 . The method of claim 1 wherein mounting the top package includes mounting an off-center parting line package.

4 . The method of claim 1 wherein mounting the top package on the bottom package includes mounting the top package body directly on the bottom package body.

5 . The method of claim 1 further comprising forming a lead overlap between the top connection leads and the bottom connection leads.

6 . A method of manufacture of an integrated circuit package stacking system comprising:

providing a bottom package including:

providing a first lead frame having bottom leads,

forming a bottom package body having the first lead frame in an off-centered parting line position including molding an epoxy molding compound on the bottom leads, and

forming bottom connection leads of the first lead frame for providing coplanar contacts at an end of the bottom connection leads;

mounting a top package on the bottom package including:

providing a second lead frame having top leads,

forming a top package body on the second lead frame including molding the epoxy molding compound on the top leads, and

reforming top connection leads of the second lead frame for over-lapping contact areas on the bottom connection leads of the bottom package; and

applying a conductive adhesive on the contact areas for electrically connecting the top connection leads and the bottom connection leads.

7 . The method of claim 6 wherein mounting the top package includes mounting a center parting line package further comprising providing a lead bend distance of substantially 0.040 mm.

8 . The method of claim 6 wherein mounting the top package includes mounting an off-center parting line package further comprising providing a lead bend distance in the range of 0.04 mm and 0.093 mm.

9 . The method of claim 6 further comprising forming a bend angle, in the top connection leads, with a range of between 11° and 15°.

10 . The method of claim 6 further comprising forming a lead overlap between the top connection leads and the bottom connection leads wherein forming the lead overlap is in the range of 0.23 mm and 0.42 mm.

11 . An integrated circuit package stacking system comprising:

a bottom package includes:

a first lead frame,

a bottom package body, formed on the first lead frame, having the first lead frame in an off-centered parting line position, and

bottom connection leads formed of the first lead frame having coplanar contacts at an end of the bottom connection leads;

a top package mounted on the bottom package includes:

a second lead frame,

a top package body molded on the second lead frame, and

top connection leads formed of the second lead frame with contact areas on the bottom connection leads of the bottom package overlapped by the top connection leads; and

a conductive adhesive on the contact areas for electrically connecting the top connection leads and the bottom connection leads.

12 . The system of claim 11 wherein the top package mounted includes a center parting line package mounted on the bottom package.

13 . The system of claim 11 wherein the top package mounted includes an off-center parting line package mounted on the bottom package.

14 . The system of claim 11 wherein the top package on the bottom package includes the top package body directly on the bottom package body.

15 . The system of claim 11 further comprising a lead overlap between the top connection leads and the bottom connection leads.

16 . The system of claim 11 further comprising:

bottom leads in the first lead frame;

an epoxy molding compound molded on the bottom leads forms the bottom package body;

top leads in the second lead frame; and

the epoxy molding compound molded on the top leads forms the top package body.

17 . The system of claim 16 wherein the top package mounted includes a center parting line package mounted on the bottom package further comprising a lead bend distance of substantially 0.040 mm from the top package body.

18 . The system of claim 16 wherein the top package mounted includes an off-center parting line package mounted on the bottom package further comprising a lead bend distance in the range of 0.040 mm to 0.093 mm from the top package body.

19 . The system of claim 16 further comprising a bend angle, formed in the top connection leads, with a range of between 11° and 15°.

20 . The system of claim 16 further comprising a lead overlap between the top connection leads and the bottom connection leads wherein the lead overlap is in the range of 0.23 mm and 0.42 mm.