Patent Assignment
Reel/Frame 024541/0765
Assignment of Assignor's Interest
Recorded: 2010-06-16
Pages: 4
Assignors
GUO, YI
Executed: 2010-03-23
LIU, ZHENDONG
Executed: 2010-03-23
REDDY, ARUN
Executed: 2010-03-23
ZHANG, GUANGYUN
Executed: 2010-03-24
Assignee
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
451 BELLEVUE ROAD, NEWARK, DELAWARE, 19713
Covered Property
(1)
Method of chemical mechanical polishing a substrate with polishing composition adapted to enhance silicon oxide removal
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →