Patent Assignment
Reel/Frame 024566/0289
Assignment of Assignor's Interest
Recorded: 2010-06-21
Pages: 4
Assignees
BONDTECH INC.
KEIHANNA PLAZA LABO-TO, 1-7,, HIKARI-DAI, SEIKA-CHO, SORAKU-GUN, KYOTO, 619-0237, JAPAN
SUGA, TADATOMO
3-6-3, HIGASHINAKANO, NAKANO-KU, TOKYO, 164-0003, JAPAN
Covered Property
(1)
Joining Method and Device Produced by This Method and Joining Unit
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.