IP Library › Assignment 024957/0211
Patent Assignment
Reel/Frame 024957/0211

Change of Assignees Address

Recorded: 2010-09-08 Pages: 2
Assignor
BONDTECH INC.
Executed: 2009-09-28
Assignee
BONDTECH INC.
1-25, NISHINOHATA, OKUBO-CHO, UJI-SHI, KYOTO, 611-0033, JAPAN
Covered Property (1)
Joining Method and Device Produced by This Method and Joining Unit
Patent: 8,091,764 →
Application: 12/819,442 →
Publication: US 2010/0252615
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 21, 2010
From: SUGA, TADATOMO; OKADA, MASUAKI
To: BONDTECH INC.; SUGA, TADATOMO
Reel/Frame 024566/0289 →
Change of Assignee Address Nov 17, 2015
From: BONDTECH INC.
To: BONDTECH INC.
Reel/Frame 037124/0261 →