Patent Assignment
Reel/Frame 037124/0261
Change of Assignee Address
Recorded: 2015-11-17
Pages: 2
Assignor
BONDTECH INC.
Executed: 2015-11-09
Assignee
BONDTECH INC.
77, ISHIHARANISHIMACHI, KISSHOIN, MINAMI-KU, KYOTO, 601-8366, JAPAN
Covered Property
(1)
Joining Method and Device Produced by This Method and Joining Unit
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.