Patent Assignment
Reel/Frame 024573/0901
Assignment of Assignor's Interest
Recorded: 2010-06-22
Pages: 3
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Semiconductor Package Substrate with Metal Bumps
Application:
12/347,800 →
Publication:
US 2010/0167466
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct Name of Assignee Previously Recorded at Reel/Frame 024573/0901. (Attached)
Sep 9, 2010
From: ADIMULA, RAVIKUMAR; YIM, MYUNG JIN
To: NUMONYX B.V.
Reel/Frame 025052/0764 →
Assignment of Assignor's Interest
Oct 26, 2011
From: NUMONYX B.V.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 027126/0176 →