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Patent Assignment
Reel/Frame 025052/0764

Corrective Assignment to Correct Name of Assignee Previously Recorded at Reel/Frame 024573/0901. (Attached)

Recorded: 2010-09-09 Pages: 3
Assignors
ADIMULA, RAVIKUMAR
Executed: 2008-12-31
YIM, MYUNG JIN
Executed: 2008-12-30
Assignee
NUMONYX B.V.
ZONE D'ACTIVITES, LA PIECE 2, A-ONE, BUSINESS CENTER, ROUTE DE L'ETAZ, 1180 ROLLE, SWITZERLAND
Covered Property (1)
Semiconductor Package Substrate with Metal Bumps
Application: 12/347,800 →
Publication: US 2010/0167466
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 22, 2010
From: ADIMULA, RAVIKUMAR; YIM, MYUNG JIN
To: INTEL CORPORATION
Reel/Frame 024573/0901 →
Assignment of Assignor's Interest Oct 26, 2011
From: NUMONYX B.V.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 027126/0176 →