IP Library Assignment 024830/0460
Patent Assignment
Reel/Frame 024830/0460

Assignment of Assignor's Interest

Recorded: 2010-08-12 Pages: 4
Assignors
VICK, ERIK P.
Executed: 2010-04-23
MALTA, DEAN M.
Executed: 2010-04-22
LUECK, MATTHEW R.
Executed: 2010-04-28
TEMPLE, DOROTA
Executed: 2010-04-28
Assignee
RESEARCH TRIANGLE INSTITUTE
3040 CORNWALLIS ROAD, RESEARCH TRIANGLE PARK, NORTH CAROLINA, 27709
Covered Property (1)
Die Bonding Utilizing a Patterned Adhesion Layer
Patent: 8,361,901 →
Application: 12/754,396 →
Publication: US 2010/0270685
Related Assignments (7)
Other recorded transfers of the patent in this record — the chain of ownership.
Grant of Security Interest in Patents Oct 5, 2016
From: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
To: ALLY BANK
Reel/Frame 040229/0512 →
Assignment of Assignor's Interest Oct 18, 2016
From: RESEARCH TRIANGLE INSTITUTE
To: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
Reel/Frame 040387/0745 →
Security Interest Aug 7, 2017
From: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
To: MIDCAP FINANCIAL TRUST
Reel/Frame 043476/0302 →
Release of Security Interest Aug 7, 2017
From: ALLY BANK
To: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
Reel/Frame 043479/0071 →
Security Agreement Feb 6, 2020
From: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC; SILICON TURNKEY SOLUTIONS, INC.
To: ALLY BANK, AS ASSIGNEE
Reel/Frame 051836/0697 →
Release of Security Interest Feb 6, 2020
From: MIDCAP FINANCIAL TRUST
To: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
Reel/Frame 051834/0394 →
Assignment of Assignor's Interest Mar 10, 2020
From: RESEARCH TRIANGLE INSTITUTE
To: MICROSS ADVANCED INTERCONNECT TECHNOLOGY, LLC
Reel/Frame 052133/0362 →