Patent Assignment
Reel/Frame 051836/0697
Security Agreement
Recorded: 2020-02-06
Pages: 8
Assignors
MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
Executed: 2020-02-05
SILICON TURNKEY SOLUTIONS, INC.
Executed: 2020-02-05
Assignee
ALLY BANK, AS ASSIGNEE
300 PARK AVENUE, 4TH FLOOR, NEW YORK, NEW YORK, 10022
Covered Properties
(33)
Electrostatically Controlled Variable Capacitor
Patent:
6,373,682 →
Application:
09/464,010 →
Microelectromechanical Elevating Structures
Patent:
6,456,420 →
Application:
09/626,725 →
Hybrid microelectromechanical system tunable capacitor and associated fabrication methods
Patent:
6,377,438 →
Application:
09/694,835 →
Electrostatically Actuated Electromagnetic Radiation Shutter
Patent:
6,396,620 →
Application:
09/702,082 →
Overdrive Structures for Flexible Electrostatic Switch
Layer-By-Layer Assembly of Photonic Crystals
Three Dimensional Multimode and Optical Coupling Devices
Flexible Electrostatic Actuator
Structure and Process for Electrical Interconnect and Thermal Management
Large Substrate Structural Vias
Semiconductor Substrate Elastomeric Stack
Comb-Shaped Power Bus Bar Assembly Structure Having Integrated Capacitors
Preventing Breakage of Long Metal Signal Conductors on Semiconductor Substrates
Integrated Semiconductor Substrate Structure Using Incompatible Processes
Local Defect Memories on Semiconductor Substrates in a Stack Computer
Integral Metal Structure with Conductive Post Portions
Multiple-Layer Signal Conductor
Die Bonding Utilizing a Patterned Adhesion Layer
Large Substrate Structural Vias
Integrated Semiconductor Substrate Structure Using Incompatible Processes
Preventing breakage of long metal signal conductors on semiconductor substrates
Three Dimensional Interconnect Structure and Method Thereof
Structure And Process For Electrical Interconnect And Thermal Management
Fluorescence Based Thermometry
Rare Earth-Doped Materials with Enhanced Thermoelectric Figure of Merit
Systems and Methods for Thermal Control
Three-Dimensional Electronic Packages Utilizing Unpatterned Adhesive Layer
Location of Sensors in Well Formations
Electronic Devices Utilizing Contact Pads with Protrusions and Methods for Fabrication
Detection of Corrosion Using Dispersed Embedded Sensors
Electronic Packages with Three-Dimensional Conductive Planes, and Methods for Fabrication
Electronic Packages with Three-Dimensional Conductive Planes, and Methods for Fabrication
Detection of Corrosion Using Dispersed Embedded Sensors
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Grant of Security Interest in Patents
Oct 5, 2016
From: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
To: ALLY BANK
Reel/Frame 040229/0512 →
Assignment of Assignor's Interest
Oct 18, 2016
From: RESEARCH TRIANGLE INSTITUTE
To: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
Reel/Frame 040387/0745 →
Security Interest
Aug 7, 2017
From: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
To: MIDCAP FINANCIAL TRUST
Reel/Frame 043476/0302 →
Release of Security Interest
Aug 7, 2017
From: ALLY BANK
To: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
Reel/Frame 043479/0071 →
Release of Security Interest
Feb 6, 2020
From: MIDCAP FINANCIAL TRUST
To: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
Reel/Frame 051834/0394 →
Assignment of Assignor's Interest
Mar 10, 2020
From: RESEARCH TRIANGLE INSTITUTE
To: MICROSS ADVANCED INTERCONNECT TECHNOLOGY, LLC
Reel/Frame 052133/0362 →