Patent Assignment
Reel/Frame 051834/0394
Release of Security Interest
Recorded: 2020-02-06
Pages: 11
Assignor
MIDCAP FINANCIAL TRUST
Executed: 2020-02-03
Assignee
MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
3021 E. CORNWALLIS ROAD, DURHAM, NORTH CAROLINA, 27709
Covered Properties
(46)
Modulatable Reflectors and Methods for Using Same
Patent:
6,137,623 →
Application:
09/042,836 →
Methods of Raising Reflow Temperature of Glass Alloys by Thermal Treatment in Steam, and Microelectronic Structures Formed Thereby
Patent:
6,271,150 →
Application:
09/201,447 →
Micromachined Electrostatic Actuator with Air Gap
Patent:
6,236,491 →
Application:
09/320,891 →
Arc Resistant High Voltage Micromachined Electrostatic Switch
Patent:
6,057,520 →
Application:
09/345,300 →
Miniature Electrical Relays Using a Piezoelectric Thin Flim as an Actuating Element
Patent:
6,359,374 →
Application:
09/448,080 →
Electrostatically Controlled Variable Capacitor
Patent:
6,373,682 →
Application:
09/464,010 →
Microelectromechanical Elevating Structures
Patent:
6,456,420 →
Application:
09/626,725 →
Methods for modulating a radiation signal
Patent:
6,233,088 →
Application:
09/636,141 →
Hybrid microelectromechanical system tunable capacitor and associated fabrication methods
Patent:
6,377,438 →
Application:
09/694,835 →
Electrostatically Actuated Electromagnetic Radiation Shutter
Patent:
6,396,620 →
Application:
09/702,082 →
Overdrive Structures for Flexible Electrostatic Switch
Mems Electrostatically Actuated Optical Display Device and Associated Arrays
Layer-By-Layer Assembly of Photonic Crystals
Three Dimensional Multimode and Optical Coupling Devices
Electromagnetic Radiation Detectors Having a Microelectromechanical Shutter Device
Layered Photonic Crystals
Three Dimensional Multimode and Optical Coupling Devices
Dc-Dc Converter for Low Voltage Power Source
Flexible Electrostatic Actuator
Structure and Process for Electrical Interconnect and Thermal Management
Large Substrate Structural Vias
Semiconductor Substrate Elastomeric Stack
Comb-Shaped Power Bus Bar Assembly Structure Having Integrated Capacitors
Preventing Breakage of Long Metal Signal Conductors on Semiconductor Substrates
Integrated Semiconductor Substrate Structure Using Incompatible Processes
Local Defect Memories on Semiconductor Substrates in a Stack Computer
Stackable Self-Aligning Insulative Guide Tray for Holding Semiconductor Substrates
Integral Metal Structure with Conductive Post Portions
Multiple-Layer Signal Conductor
Die Bonding Utilizing a Patterned Adhesion Layer
In system reflow of low temperature eutectic bond balls
Large Substrate Structural Vias
Integrated Semiconductor Substrate Structure Using Incompatible Processes
Preventing breakage of long metal signal conductors on semiconductor substrates
Three Dimensional Interconnect Structure and Method Thereof
Structure And Process For Electrical Interconnect And Thermal Management
Through-Substrate Via Having a Strip-Shaped Through-Hole Signal Conductor
Fluorescence Based Thermometry
Rare Earth-Doped Materials with Enhanced Thermoelectric Figure of Merit
Reflow of Bond Balls by Increasing the Temperature of an Fpga by Increasing Power Dissipation of Gates Using a Bit Stream
Application:
14/167,188 →
Publication:
US 2014/0144971
Nanoparticle Compact Materials for Thermoelectric Application
Application:
14/359,817 →
Publication:
US 2014/0318593
Three-Dimensional Electronic Packages Utilizing Unpatterned Adhesive Layer
Location of Sensors in Well Formations
Electronic Devices Utilizing Contact Pads with Protrusions and Methods for Fabrication
Detection of Corrosion Using Dispersed Embedded Sensors
Electronic Packages with Three-Dimensional Conductive Planes, and Methods for Fabrication
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Grant of Security Interest in Patents
Oct 5, 2016
From: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
To: ALLY BANK
Reel/Frame 040229/0512 →
Assignment of Assignor's Interest
Oct 18, 2016
From: RESEARCH TRIANGLE INSTITUTE
To: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
Reel/Frame 040387/0745 →
Security Interest
Aug 7, 2017
From: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
To: MIDCAP FINANCIAL TRUST
Reel/Frame 043476/0302 →
Release of Security Interest
Aug 7, 2017
From: ALLY BANK
To: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
Reel/Frame 043479/0071 →
Security Agreement
Feb 6, 2020
From: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC; SILICON TURNKEY SOLUTIONS, INC.
To: ALLY BANK, AS ASSIGNEE
Reel/Frame 051836/0697 →
Assignment of Assignor's Interest
Mar 10, 2020
From: RESEARCH TRIANGLE INSTITUTE
To: MICROSS ADVANCED INTERCONNECT TECHNOLOGY, LLC
Reel/Frame 052133/0362 →