Patent Assignment
Reel/Frame 024940/0659
Assignment of Assignor's Interest
Recorded: 2010-09-03
Pages: 4
Assignors
LU, HAMILTON
Executed: 2010-08-27
CHAU, THE-TU
Executed: 2010-08-19
TERRILL, KYLE
Executed: 2010-08-19
PATTANAYAK, DEVA
Executed: 2010-08-19
SHI, SHARON
Executed: 2010-08-19
CHEN, KUO-IN
Executed: 2010-08-20
XU, ROBERT
Executed: 2010-08-19
Assignee
VISHAY-SILICONIX
2201 LAURELWOOD RD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
System and Method for Substrate Wafer Back Side and Edge Cross Section Seals
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
Security Interest
Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
Release of Security Interest
Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED
Reel/Frame 049826/0312 →