Change of Name

Recorded: 2010-09-23 Pages: 44

Assignor

RENESAS TECHNOLOGY CORP.

Executed: 2010-04-01

Assignee

RENESAS ELECTRONICS CORPORATION

1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI,, KANAGAWA, 211-8668, JAPAN

Covered Properties (4)

Semiconductor Memory Device with Bit Line of Small Resistance and Manufacturing Method Thereof

Patent: 7,985,648 →

Application: 12/717,753 →

Publication: US 2010/0155822

Semiconductor Device

Patent: 7,920,012 →

Application: 12/797,812 →

Publication: US 2010/0244924

Semiconductor Device Having Elastic Solder Bump to Prevent Disconnection

Patent: 7,951,701 →

Application: 12/817,742 →

Publication: US 2010/0255673

Can System

Patent: 8,001,453 →

Application: 12/846,404 →

Publication: US 2010/0313080

Related Assignments (1)

Other recorded transfers of the patents in this record — the chain of ownership.