Patent Assignment
Reel/Frame 025105/0799
Security Agreement
Recorded: 2010-10-08
Received: 2010-10-08
Pages: 14
Assignor
OEM GROUP, INC.
Executed: 2010-10-07
Assignee
COMERICA BANK, A TEXAS BANKING ASSOCIATION
39200 SIX MILE ROAD, LIVONIA, MI, 48152, UNITED STATES
Covered Properties
(21)
Dry Etch Stop Process for Eliminating Electrical Shorting in Mram Device Structures
Application:
12/552,664 →
Reactor with Heated and Textured Electrodes and Surfaces
Application:
12/203,022 →
Dry Etch Stop Process for Eliminating Electrical Shorting in Mram Device Structures
Application:
11/724,556 →
Stator Winding Having Two Slots Per Phase Per Pole
Application:
11/100,012 →
Plasma Etch Reactor and Method
Application:
11/087,540 →
Vehicle Seat
Application:
29/220,753 →
System and Method for Processing a Wafer Including Stop-on-Alumina Processing
Application:
10/937,660 →
Pumps for Filtration Systems
Application:
10/759,750 →
Vehicle Seat
Application:
29/191,879 →
System for, and Method of, Etching a Surface on a Wafer
Application:
10/633,839 →
Reactive Sputtering of Silicon Nitride Films by Rf Supported Dc Magnetron
Application:
10/446,005 →
Magnetron with adjustable target positioning
Application:
10/371,862 →
Magnetron with Controlled Dc Power
Application:
10/371,463 →
Cluster Tool with a Hollow Cathode Array
Application:
10/212,293 →
Plasma Etch Reactor and Method
Application:
10/156,478 →
Permanent Adherence of the Back End of a Wafer to an Electrical Component or Sub-Assembly
Application:
10/051,886 →
Flat Magnetron
Application:
09/949,181 →
Reactor with Heated and Textured Electrodes and Surfaces
Application:
09/888,365 →
Method for Minimizing the Critical Dimension Growth of a Feature on a Semiconductor Wafer
Application:
09/880,584 →
System for, and Method of, Etching a Surface on a Wafer
Application:
09/829,587 →
Dual Degas/Cool Loadlock Cluster Tool
Application:
09/798,048 →