Patent Assignment
Reel/Frame 025174/0013
Assignment of Assignor's Interest
Recorded: 2010-10-21
Pages: 2
Assignors
HOSHI, YOUSUKE
Executed: 2010-08-20
RYUZAKI, DAISUKE
Executed: 2010-08-26
KOYAMA, NAOYUKI
Executed: 2010-08-30
NOBE, SHIGERU
Executed: 2010-08-11
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU,, TOKYO, JAPAN
Covered Property
(1)
Polishing Agent and Method for Polishing Substrate Using the Polishing Agent
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Original Electronic Cover Sheet, the Assignee's Address Is Incorrect, Previously Recorded on Reel 025174 Frame 0013. Assignor(S) Hereby Confirms the Assignment.
Nov 9, 2010
From: HOSHI, YOUSUKE; RYUZAKI, DAISUKE; KOYAMA, NAOYUKI; NOBE, SHIGERU
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 025333/0652 →
Notice of Change of Address of Assignee
Nov 26, 2013
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 031728/0056 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →