Patent Assignment
Reel/Frame 031728/0056
Notice of Change of Address of Assignee
Recorded: 2013-11-26
Pages: 3
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-01-01
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Polishing Agent and Method for Polishing Substrate Using the Polishing Agent
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 21, 2010
From: HOSHI, YOUSUKE; RYUZAKI, DAISUKE; KOYAMA, NAOYUKI; NOBE, SHIGERU
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 025174/0013 →
Corrective Assignment to Correct the Original Electronic Cover Sheet, the Assignee's Address Is Incorrect, Previously Recorded on Reel 025174 Frame 0013. Assignor(S) Hereby Confirms the Assignment.
Nov 9, 2010
From: HOSHI, YOUSUKE; RYUZAKI, DAISUKE; KOYAMA, NAOYUKI; NOBE, SHIGERU
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 025333/0652 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →