Patent Assignment
Reel/Frame 025333/0652
Corrective Assignment to Correct the Original Electronic Cover Sheet, the Assignee's Address Is Incorrect, Previously Recorded on Reel 025174 Frame 0013. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2010-11-09
Pages: 4
Assignors
HOSHI, YOUSUKE
Executed: 2010-08-20
RYUZAKI, DAISUKE
Executed: 2010-08-26
KOYAMA, NAOYUKI
Executed: 2010-08-30
NOBE, SHIGERU
Executed: 2010-08-11
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Polishing Agent and Method for Polishing Substrate Using the Polishing Agent
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 21, 2010
From: HOSHI, YOUSUKE; RYUZAKI, DAISUKE; KOYAMA, NAOYUKI; NOBE, SHIGERU
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 025174/0013 →
Notice of Change of Address of Assignee
Nov 26, 2013
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 031728/0056 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →