IP Library Assignment 025327/0862
Patent Assignment
Reel/Frame 025327/0862

Assignment of Assignor's Interest

Recorded: 2010-11-05 Pages: 4
Assignors
HIGASHI, ROBERT
Executed: 2010-11-03
NEWSTROM-PEITSO, KAREN MARIE
Executed: 2010-11-03
RIDLEY, JEFF A.
Executed: 2010-11-05
Assignee
HONEYWELL INTERNATIONAL INC.
101 COLUMBIA ROAD, POB 2245, MORRISTOWN, NEW JERSEY, 07962-9806
Covered Property (1)
Method for Wafer Bonding Using Gold and Indium
Patent: 8,513,091 →
Application: 12/940,773 →
Publication: US 2012/0112348
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Confirmatory License Mar 27, 2018
From: HONEYWELL INTERNATIONAL INC
To: DARPA
Reel/Frame 046529/0174 →