IP Library › Assignment 046529/0174
Patent Assignment
Reel/Frame 046529/0174

Confirmatory License

Recorded: 2018-03-27 Pages: 2
Assignor
HONEYWELL INTERNATIONAL INC
Executed: 2010-11-05
Assignee
DARPA
675 N. RANDOLPH ST., ARLINGTON, VIRGINIA, 22203
Covered Property (1)
Method for Wafer Bonding Using Gold and Indium
Patent: 8,513,091 →
Application: 12/940,773 →
Publication: US 2012/0112348
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 5, 2010
From: HIGASHI, ROBERT; NEWSTROM-PEITSO, KAREN MARIE; RIDLEY, JEFF A.
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 025327/0862 →