Method for wafer bonding using gold and indium
Devices, methods, and systems for wafer bonding are described herein. One or more embodiments include forming a bond between a first wafer and a second wafer using a first material adjacent the first wafer and a second material adjacent the second wafer. The first material includes a layer of gold (Au) and a layer of indium (In), and the second material includes a layer of Au. Forming the bond between the first wafer and the second wafer includes combining the layer of Au in the first material, the layer of In in the first material, and a portion of the layer of Au in the second material, wherein an additional portion of the layer of Au in the second material is not combined with the layer of Au in the first material and the layer of In in the first material.
1. A method for wafer bonding, comprising:
forming a bond between a first wafer and a second wafer using a first material adjacent the first wafer and a second material adjacent the second wafer, wherein:
the first material includes a layer of gold (Au) and a layer of indium (In);
the second material includes a layer of Au; and
forming the bond between the first wafer and the second wafer includes combining the layer of Au in the first material, the layer of In in the first material, and a portion of the layer of Au in the second material, wherein:
combining the layer of Au in the first material, the layer of In in the first material, and the portion of the layer of Au in the second material includes forming gamma phase Au-In; and
an additional portion of the layer of Au in the second material is not combined with the layer of Au in the first material and the layer of In in the first material.
2. The method of claim 1 , wherein the bond formed between the first wafer and the second wafer does not include voids.
3. The method of claim 1 , wherein:
the layer of Au in the first material has a thickness of approximately 2.0 micrometers (μm);
the layer of In in the first material has a thickness of approximately 1.7 μm; and
the layer of Au in the second material has a thickness of approximately 2.0 μm.
4. The method of claim 1 , wherein the method includes forming the bond between the first wafer and the second wafer using a flexible interposer material adjacent the first wafer or the second wafer.
5. The method of claim 1 , wherein combining the layer of Au in the first material, the layer of In in the first material, and the portion of the layer of Au in the second material includes forming AuIn 2 .