IP Library Assignment 025611/0386
Patent Assignment
Reel/Frame 025611/0386

Assignment of Assignor's Interest

Recorded: 2011-01-10 Pages: 5
Assignors
BEI, DUO HUI
Executed: 2011-01-07
LIU, MING YUAN
Executed: 2011-01-10
ZHENG, CHUN SHENG
Executed: 2011-01-07
Assignee
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANG JIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property (1)
Method for Copper Hillock Reduction
Patent: 8,815,615 →
Application: 12/938,158 →
Publication: US 2012/0070915
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 14, 2013
From: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
Reel/Frame 029625/0763 →