IP Library Assignment 025855/0192
Patent Assignment
Reel/Frame 025855/0192

Assignment of Assignor's Interest

Recorded: 2011-02-28 Received: 2011-02-28 Pages: 14
Assignor
Assignee
JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
1111 FANNIN, 10TH FLOOR, HOUSTON, TX, 77002, UNITED STATES
Covered Properties (30)
Flame Retardant Polymer Compositions
Application: 10/539,844 →
Accelerator Systems for Low-Temperature Curing
Application: 10/552,908 →
1-Imidazolymethyl -Substituted -2-Naphtols and Their Use as Accelerators for Low - Temperature Curing
Application: 10/552,902 →
Epoxy Resin Composition
Application: 10/551,938 →
Actinic Radiation Curable Compositions and Their Use
Application: 10/516,978 →
Tool Consisting of Plastic Material
Application: 10/520,055 →
Method of Making Models
Application: 10/498,692 →
Production of Composites Articles Composed of Thin Layers
Application: 10/495,028 →
Uv-Curable Compositions
Application: 11/054,208 →
Jettable Compositions
Application: 10/515,793 →
Photocurable Compositions Containing Reactive Particles
Application: 10/511,924 →
Heat-Curable Resin Composition
Application: 10/498,036 →
Tool made from plastic
Application: 10/494,916 →
Three-Dimensional Printing
Application: 10/468,329 →
Amine Hardener for Epoxy Resins
Application: 10/815,532 →
Three-Dimensional Structured Printing
Application: 10/479,303 →
Epoxy Resin
Application: 10/485,440 →
Photocurable Compositions for Articles Having Stable Tensile Properties
Application: 10/678,253 →
Adducts of Polyalkylene Glycol Monoglycidyl Ethers and Amine Compounds
Application: 10/472,100 →
Three-Dimensional Structured Printing
Application: 10/399,444 →
Flame-Proofing Agents
Application: 10/466,944 →
Seamless Model and Method of Making a Seamless Model
Application: 10/380,392 →
Positive Type Photosensitive Epoxy Resin Composition and Printed Circuit Board Using the Same
Application: 10/416,978 →
Epoxy Resin Composition
Application: 10/182,412 →
Process for the Preparation of Reaction Products of Cycloaliphatic Epoxides with Multifunctional Hydroxy Compounds
Application: 10/018,667 →
Uv-Curable Compositions
Application: 10/088,564 →
Liquid, radiation-curable composition, especially for producing flexible cured articles by stereolithography
Application: 10/167,436 →
Amine-Modified Epoxy Resin Reacted in Presence of Latent Hardener
Application: 09/986,815 →
Matting Agents for Thermally Curable Systems
Application: 09/937,001 →
Transaminated Dialkylaminoalkylphenol-3 and 1 Amine-Containing Compound
Application: 09/787,165 →