IP Library › Assignment 025966/0587
Patent Assignment
Reel/Frame 025966/0587

Assignment of Assignor's Interest

Recorded: 2011-03-16 Pages: 3
Assignors
ITO, JUNICHI
Executed: 2010-12-24
YABE, ATSUSHI
Executed: 2010-12-24
SEKIGUCHI, JUNNOSUKE
Executed: 2010-12-24
IMORI, TORU
Executed: 2010-12-24
YAMAKOSHI, YASUHIRO
Executed: 2010-12-24
SENDA, SHINICHIRO
Executed: 2010-12-24
Assignee
JX NIPPON MINING & METALS CORPORATION
6-3, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Plated Product Having Copper Thin Film Formed Thereon by Electroless Plating
Patent: 8,283,051 →
Application: 12/737,399 →
Publication: US 2011/0129688
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Feb 7, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041649/0733 →
Change of Address Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →